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The Cisco XENKAP with high heat-dissipation performance

The Cisco XENKAP with high heat-dissipation performance . From the end user's perspective, the main difference between Cisco XENPAK, X2, XFP is the mechanical dimensions, supporting port-types and 10G protocol (except for 10GE).

 

The Cisco XENPAK is the largest module among these three fiber optic modules. And the Cisco XENPAK module has a multi-functional advantage because of its increased size. From example, more space benefits to the integrated optical networks and electronic components. They will have higher heat-dissipation efficiency and reduce the demand of heat-dissipation.

 

XENPAK modules

 

Therefore, Cisco XENPAK supports the widest range of port-types to meet the needs of the high-power DWDM interface and the 80Km PMD. With the development of the technology, the existing problems of the supporting port-types will disappear.

10Gbit/s XENPAK 1550nm 10GBASE-ZR Transponder

10Gbit/s XENPAK 1550nm 80km 10GBASE-ZR Transponder. XENPAK MSA Compliant. 70-PIN connector. SC duplex receptacle package. XAUI 4x3.125Gb/s and TX/RX 10Gb/s data rate. Cooled EA-DFB/PIN-PD. Power supply: +5.0 V, +3.3 V, APS:+1.2 V. Power Dissipation 4W Maximum. 0ºC to 70ºC Operating Case Temperature. Digital Diagnostic Monitoring

10 GB/s CWDM XENPAK ER Transponder
10GB/s 40km CWDM XENPAK ER Transponder. XENPAK MSA Compliant. 70-PIN connector. SC duplex receptacle package. Wavelength selectable to ITU-T standards covering CWDM grid wavelengths. Cooled EA-DFB/PIN-PD. Power supply: +5.0 V, +3.3 V, APS:+1.2 V Power Dissipation 4W Maximum. 0ºC to 70ºC Operating Case Temperature
10 GB/s DWDM XENPAK ER Transponder
10GB/s 40km DWDM XENPAK ER Transponder. XENPAK MSA Compliant. 70-PIN connector. SC duplex receptacle package. Wavelength selectable to C-band ITU-T grid wavelengths. Cooled EA-DFB/PIN-PD. Power supply: +5.0 V, +3.3 V, APS:+1.2 V. Power Dissipation 4W Maximum. 0ºC to 70ºC Operating Case Temperature. Digital Diagnostic Monitoring

Related Tutorials

Optical Module Frequently Asked Questions:

Take 1.25G SFP module as an example. 1. Optical power badness: 2. Eye diagram badness; 3. Receiving end badness; 4. Working current badness; 5. Program Programming failed;

Common-Badness Reason Judging Method

1. Visual Method: Check the faulty module appearance. Whether there is obvious damage, component burned black, dehiscence, leakage, even tin or not.2. Comparative Law: Use certain tools and a good module. Test the good module and the target module. Mainly analyze circuit parts or components' resistance, voltage, waveform, etc. Then make a comparison.3. Substitution Method: To replace the components of the module; then to analyze the change of operating parameters.  4. Others

Reason and Maintenance methods of common problem of optical module internally

A. Optical power badness performance A1. BIAS optical bias current within the normal range, the optical power exceeds out of the control range. A2. Laser bias current of BIAS in the normal range, the optical power is less than the control range. A3. There is no light. A3.a. BIAS value is displayed as 0. A3.b. BIAS short circuit, value is very great, displayed as 90mA ~ 150mA; and data can be saved. A4. There is light during the debug process, but the optical power don't change A5. Optical power is unstable. A6. Side mode suppression ratio is small. B. Eye diagram badness performance B1. Extinction ratio of non-performing B1.a Small extinction ratio B1.b Large extinction ratio B2. Eye
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